The "Startup Showcase" at Hack Osaka 2023 is a booth exhibition for up-and-coming companies developing products and services based on various technologies, such as IoT, AI, AR/VR, software, and consumer electronics.
About 40 domestic and international startups will participate in the event, and each booth will feature promotions and demonstrations of their attractive products and services. If you're interested in the latest technology, if you're a venture capitalist looking for an investment opportunity, or if you're looking to collaborate with a startup, develop a product, or create a new business, we’d like to invite you to come!
We’re looking forward to having you!
< About the Exhibition >
If you would like to participate in the exhibition, please press the button below to apply.
Overview
Date/Time
Tuesday, February 21, 2023 from 10 AM to 6 PM
Venue
Congress Convention Center Room 1~3
(Grand Front Osaka North Building, B2F, 3-1 Ofukacho, Kita-ku, Osaka)
Program
＜Startup Showcase (Exhibition)＞
Tuesday, February 21, 2023 from 10 AM to 6 PM
＜Startup Shout-out Stage (Pitches)＞
Tuesday, February 21, 2023 from 1:30 PM to 3:30 PM (scheduled)
*Pitch event in which exhibitors promote their services to visitors
*Pitch time allotted per company: 3 minutes
＜Speed Dating (VC/CVC individual interviews)＞
Tuesday, February 21, 2023 from 1 PM to 6 PM
Individual meetings with VC/CVC
*Duration: 15 minutes per interview
Contact
Startup Showcase Administration Office
Osaka Innovation Hub (OIH)
Point of contact: Kamitani
Mail: ohclub@innovation-osaka.jp
TEL: 06-6359-3004 (Monday-Friday 10 AM to 6 PM * Excluding holidays and New Year holidays)
Venue Map
Exhibitors
| 社名 | 参加者氏名 | 役職 | 事業内容 | カテゴリー | Region | ウェブサイト | 参加意思表明 | 面談希望先 |
|---|---|---|---|---|---|---|---|---|
| No.1 | ITD-GBS Tokyo (Mobyl) | Tokyo | ||||||
| No.2 | iDevice, Inc. | Osaka | ||||||
| No.3 | AXIVE | Tokyo | ||||||
| No.4 | Inner Resource, Inc. | Tokyo | ||||||
| No.5 | xRsion Inc. | Hyogo | ||||||
| No.6 | Engineerforce Inc. | Tokyo | ||||||
| No.7 | enstem | Tokyo | ||||||
| No.8 | Osaka Heat Cool Inc. | Osaka | ||||||
| No.9 | OZ1 Corporation | Tokyo | ||||||
| No.10 | Suppleno | Osaka | ||||||
| No.11 | Sydecas Inc. | Hyogo | ||||||
| No.12 | SQRIE.Co.,Ltd | Kyoto | ||||||
| No.13 | SPLYZA Inc, | Shizuoka | ||||||
| No.14 | ttco | Tokyo | ||||||
| No.15 | TECH MONSTER Inc. | Hyogo | ||||||
| No.16 | TODOONADA | Tokyo | ||||||
| No.17 | NeuralPort | Hyogo | ||||||
| No.18 | Virtual Motorsport Lab Inc. | Osaka | ||||||
| No.19 | Parity Innovations Co., Ltd. | Kyoto | ||||||
| No.20 | FUNFO INC. | Kyoto | ||||||
| No.21 | PEEL Lab | Osaka | ||||||
| No.22 | PLEN Robotics Inc. | Osaka | ||||||
| No.23 | floorvr | Osaka | ||||||
| No.24 | Liberaware Co., Ltd. | Chiba | ||||||
| No.25 | ugo | Tokyo | ||||||
| No.26 | Bibit.id | Indonesia | ||||||
| No.27 | Bramble Energy Ltd. | United Kingdom | ||||||
| No.28 | Chia Network Inc. | U.S.A. | ||||||
| No.29 | Descartes Underwriting | France | ||||||
| No.30 | Hylium Industries Inc. | Korea | ||||||
| No.31 | ICAROS GmbH | Germany | ||||||
| No.32 | JOOKS | France | ||||||
| No.33 | NEOLITHE | France | ||||||
| No.34 | Seevix Material Sciences Ltd. | Israel | ||||||
| No.35 | HUMAN BIONICS | Colombia | ||||||
| No.36 | LLVISION | China | ||||||
| No.37 | Tokamak Energy | United Kingdom | ||||||
| No.38 | Wanka tanka | Israel |